Fingerprint sensor and integratable electronic display

ABSTRACT

A fingerprint sensor which includes a conductive layer which is incorporatable within an electronic display is disclosed. The fingerprint sensor also includes a controller coupled to the conductive layer to capture a fingerprint image and can further be adapted to control the display.

CROSS-REFERENCE

This application is a continuation-in-part application of Ser. No.12/914,812 filed Oct. 28, 2010, entitled “Integrated Fingerprint Sensorand Display” which claims the benefit of U.S. Provisional PatentApplication Ser. No. 61/256,908 filed Oct. 30, 2009, entitled “Systemsand Methods for Sensing Finger Prints Through a Display,” thisapplication is also a continuation-in-part application of Ser. No.12/916,000 filed Oct. 29, 2010, entitled “Systems and Methods forSensing Finger Prints Through a Display” which claims the benefit ofU.S. Provisional Patent Application Ser. No. 61/256,908 filed Oct. 30,2009, entitled “Systems and Methods for Sensing Finger Prints Through aDisplay,” each of which are incorporated herein by reference in itsentirety.

BACKGROUND OF THE INVENTION

Since its inception, fingerprint sensing technology has revolutionizedbiometric identification and authentication processes. In most cases, asingle fingerprint can be used to uniquely identify an individual in amanner that cannot be easily replicated or imitated. The ability tocapture and store fingerprint image data in a digital file of minimalsize has yielded immense benefits in fields such as law enforcement,forensics, and information security.

However, the widespread adoption of fingerprint sensing technology in abroad range of applications has faced a number of obstacles. Among theseobstacles is the need for a separate and distinct apparatus forcapturing a fingerprint image. Additionally, such components are oftenimpractical for use in systems that are designed to be of minimal sizeor weight. As handheld devices begin to take on a greater range offunctionality and more widespread use, engineers and designers of suchdevices are constantly seeking ways to maximize sophistication and easeof use while minimizing size and cost. Typically, such devices onlyincorporate input/output components that are deemed to be essential tocore functionality, e.g., a screen, and a limited set of buttons.

For these reasons, fingerprint-based authentication techniques have notreplaced username and password authentication in the most commoninformation security applications such as email, online banking, andsocial networking. Paradoxically, the growing amount of sensitiveinformation Internet users are entrusting to remote computer systems hasintensified the need for authentication procedures more reliable thanpassword-based techniques.

A display with built-in fingerprint sensing capability would thus leadto increased adoption of fingerprint-based authentication. However, aproblem with simply integrating existing fingerprint sensing technologyinto electronic devices is hardware incompatibility. Most fingerprintsensors require a silicon circuit on which to mount the fingerprintsensing components. Incorporating such a circuit, whether resistive,capacitive, thermal, or optical, into a display would requiresignificant and costly modifications to the design and productionprocesses of such displays.

As will be seen, the present disclosure provides such a system thatovercomes these obstacles.

SUMMARY OF THE INVENTION

An aspect of the disclosure is directed to a sensor comprising: a sensorpositionable within 150 microns of an uppermost surface of an electronicdevice display; and a controller coupled to the sensor to capture afingerprint image wherein the controller is positionable underneath alower surface of the electronic device display; further wherein thesensor is integrated into the electronic device display between a coverlens and a protective layer. Additionally, the sensor can be adaptableand configurable such that the electronic display further comprises atouch sensor. Moreover, the touch sensor can be configured such that itis controllable by a touch sensor controller. In another aspect, thecontroller coupled to the sensor can further be coupled to a touchsensor. In at least some configurations, a mask layer is provided. Themask layer can be positioned such that it has an upper surface adjacentthe protective layer. Additionally, the conductive layer can bepositioned such that it is disposed on a bottom surface of a mask layerand positioned on a lower surface of the protective layer. The masklayer can further include an indication, such as an aperture in themask, of a fingerprint sensing area. In some aspects one or morecontrollers can be provided and further can be, but is not limited to, achip-on-flex configuration. Additionally, the sensor can be configuredsuch that it comprises at least one conductive layer. Conductive layerscan be formed from materials selected from one or more of indium tinoxide, carbon nanotubes, metal nanowires, conductive transparentpolymers and fine line metal. Additionally, the conductive layer can beformed from a flexible material. In at least some configurations, ormore of each of a planarization layer, an optical coating, an opticallyclear adhesive, a clear plastic film, and a hard coat can be provided.Suitable material for the protective layer is selected from the groupcomprising ultra thin glass and polyethylene terephthalate. Furthermore,in at least some configurations, a hard coating is applied to theprotective layer. Additionally, the fingerprint sensor can further beconfigurable to comprise a conductive layer and the touch sensor can beconfigurable to further comprise a conductive layer and further whereinthe conductive layer of the fingerprint sensor and the conductive layerof the touch sensor are integrally formed.

Yet another aspect of the disclosure provides for an electronic display.The electronic display is configurable to comprise: an electronicdisplay module configured to produce a visible display; a protectivelayer located above the electronic display module and configured todurably receive a user's finger surface; a fingerprint sensor; and acontroller coupled to the fingerprint sensor to capture a fingerprintimage when a user's fingerprint is sensed. A motion sensor can beprovided for detecting a motion of a finger on the fingerprint sensor.Additionally, a display controller can be provided that is coupleable tothe display module and configurable to control the visible display ofthe display module. The display controller can be configured such thatit is coupleable to the fingerprint sensor such that the controllercontrols the fingerprint sensor. In at least some configurations asingle controller can be provided which is configured to control morethan one aspect of the electronic display. The fingerprint sensor canfurther comprise a conductive layer disposed under a mask layer on thebottom surface of the protective layer. The mask layer can be configuredsuch that it includes an identification of a fingerprint sensing area,such as an aperture in the mask. Additionally, the controller can be achip-on-flex in some configurations. The sensor comprises at least oneconductive layer. The conductive layer can be selected from one or moreof indium tin oxide, carbon nanotubes, metal nanowires, conductivetransparent polymers and fine line metal. In at least someconfigurations, the conductive layer is a flexible material.Additionally, one or more of each of a planarization layer, an opticalcoating, an optically clear adhesive, a clear plastic film, and a hardcoat can be provided. Moreover, the protective layer can be selectedfrom the group comprising ultra thin glass and polyethyleneterephthalate. In at least some configurations, a hard coating isapplied to the protective layer. Additionally, the display can furthercomprise a touch sensor. In at least some aspects, the fingerprintsensor further comprises a conductive layer and the touch sensor furthercomprises a conductive layer and further wherein the conductive layer ofthe fingerprint sensor and the conductive layer of the touch sensor areintegrally formed. The devices can be integrally formed with thefingerprint sensor such that the overall component possesses everythingneeded to operate. As will be appreciated by those skilled in the art,this can be achieved by forming a one piece component or by formingcomponents that act in a unified manner when constructed.

An additional aspect of the disclosure is directed to a method ofassembling an electronic display. The method of assembling the devicecomprises: providing a printed circuit board; mounting a displaycontroller on the printed circuit board; mounting an display moduleabove the printed circuit board; positioning a fingerprint sensorcircuitry on upper side of the display module, wherein the fingerprintsensor is positioned within 150 microns of an uppermost surface of theelectronic display; and applying a protective cover to the uppermostsurface of the electronic display, wherein the protective cover ispositioned over the fingerprint sensor circuitry. In at least someaspects, the method can further comprise one or more of the steps of:applying a mask layer between the protective cover and the display; andmounting a user protective surface above the mask layer. The displaycontroller can be configurable to control one or more aspects of thedevice including, for example, the motion sensor and the fingerprintsensor. In at least some aspects, the method can include the step ofconnecting the display controller to the motion sensor and thefingerprint sensor, and/or mounting a fingerprint sensor controller onthe printed circuit board. Additionally, the step of mounting thefingerprint sensor controller can further include connecting the displaycontroller to the motion sensor circuitry and connecting the fingerprintsensor controller to the fingerprint sensor circuitry.

Yet another aspect of the disclosure is directed to a method ofauthenticating biometric information. A method according to thedisclosure comprises: identifying a sensor positionable within 150microns of an uppermost surface of an electronic device display, and acontroller coupled to the sensor to capture a fingerprint image whereinthe controller is positionable underneath a lower surface of theelectronic device display, further wherein the sensor is integrated intothe electronic device display between a cover lens and a protectivelayer; sensing biometric information associated with a user; comparingthe sensed biometric information with a biometric template associatedwith the user; if the biometric information matches the biometrictemplate, receiving credentials associated with the user based on thebiometric information, and communicating credentials to a requestingprocess. Additionally, aspects of the disclosure include: identifying asensor positionable within 150 microns of an uppermost surface of anelectronic device display, and a controller coupled to the sensor tocapture a fingerprint image wherein the controller is positionableunderneath a lower surface of the electronic device display, furtherwherein the sensor is integrated into the electronic device displaybetween a cover lens and a protective layer; identifying a biometricdevice installed in a client device with a web-enabled application;identifying biometric information associated with a user; creating abiometric template associate with the biometric information; receivinguser credentials associated with the user; and binding the usercredentials with the biometric template.

INCORPORATION BY REFERENCE

All publications, patents, and patent applications mentioned in thisspecification are herein incorporated by reference to the same extent asif each individual publication, patent, or patent application wasspecifically and individually indicated to be incorporated by reference.

BRIEF DESCRIPTION OF THE DRAWINGS

The novel features of the invention are set forth with particularity inthe appended claims. A better understanding of the features andadvantages of the present invention will be obtained by reference to thefollowing detailed description that sets forth illustrative embodiments,in which the principles of the invention are utilized, and theaccompanying drawings of which:

FIGS. 1a-b are top views of electronic devices having a display;

FIGS. 2a-b are cross-sectional views of a the devices of FIG. 1a-bacross the lines 2-2 illustrating different fingerprint sensorintegrations;

FIG. 3 is a top view of a display having a mask layered thereon and flexsection adapted and configured to engage the chip and secure the chip toan interior surface within the device housing;

FIGS. 4a-b are exploded views of display devices shown in FIGS. 2a -b;

FIG. 5a illustrates layers of a fingerprint sensor having a two layersof conductors on the bottom-side of a film; FIG. 5b illustrates thelayers of FIG. 5a positioned such that the fingerprint sensor isadjacent a wall of the device housing;

FIG. 6a illustrates layers of a fingerprint sensor having a two layersof conductors on the top-side of a film; FIG. 6b illustrates the layersof FIG. 6a positioned such that the fingerprint sensor is adjacent awall of the device housing;

FIG. 7a illustrates layers of a fingerprint sensor having a flexibletransparent conductor on the bottom-side of a film; FIG. 7b illustratesthe layers of FIG. 7a positioned such that the finger print sensor isadjacent a wall of the device housing;

FIG. 8a illustrates layers of a fingerprint sensor having a flexibletransparent conductor on the bottom-side of a film; FIG. 8b illustratesthe layers of FIG. 8a positioned such that the fingerprint sensor isadjacent a wall of the device housing;

FIG. 9a illustrates layers of a fingerprint sensor using ultrathinglass; FIG. 9b illustrates the layers of FIG. 9a positioned such thatfingerprint sensor is adjacent a wall of the device housing;

FIG. 10a illustrates layers of a fingerprint sensor using a directbuild-up on the cover lens;

FIG. 10b illustrates the layers of FIG. 10a positioned such that thefingerprint sensor is adjacent a wall of the device housing;

FIG. 11 illustrates a portion of a display which uses metal leadsprinted to wrap-around the edge of the cover lens;

FIG. 12a illustrates the use of wrap-around leads in a direct build-upapproach; FIG. 12b illustrates the layers of FIG. 12a positioned suchthat the fingerprint sensor is adjacent a wall of the device housing;

FIG. 13a illustrates the use of wrap-around leads in an ultrathin glassapproach; FIG. 13b illustrates the layers of FIG. 13a positioned suchthat the fingerprint sensor is adjacent a wall of the device housing;

FIG. 14 illustrates a sensing device configured for use with a displaydevice; and

FIG. 15 illustrates the use of a device according to the disclosurewithin a communication network.

DETAILED DESCRIPTION OF THE INVENTION

A variety of electronic displays are used with electronic devices.Displays can operate using either emissive (pixels generate light),transmissive (light transmitted through pixels) and reflective (ambientlight reflected) approaches. Display types may include, for example,liquid crystal displays (LCDs) which use liquid crystal cells thatchange transmission, or reflection in an applied electric field, organiclight emitting diode (OLED) devices which utilize a light emitting diode(LED) in which an emissive electroluminescent film of organic compoundsemits light in response to an electric current, and different types ofelectrophoretic displays in which pigmented particles are moved inresponse to an electric field (e.g. Gyricon, E-ink, etc.). Gyricon is atype of electronic paper developed at Xerox PARC and is a thin layer oftransparent plastic in which millions of small beads are randomlydisposed. The beads, somewhat line toner particles, are each containedan oil-filled cavity and are free to rotate within those cavities. Thebeads are bichromal with hemispheres of two contrasting colors andcharged such that they exhibit an electrical dipole. When voltage isapplied to the surface of the sheet, the beeds rotate to present one ofthe two colors to the viewer. Thus voltages can be applied to createimages such as text and pictures. E-ink is another type of electronicpaper manufactured by E Ink Corporation which was acquired by Prime ViewInternational.

The LCD panel typically consists of two sheets of glass separated by asealed-in liquid crystal material. Both sheets have a thin transparentcoating of conducting material, with the viewing side etched intosegments with leads going to the edge of the display. Voltages appliedbetween the front and back coatings disrupt the orderly arrangement ofthe molecules sufficiently to darken the liquid and form visiblepatterns.

Additionally, displays have been developed that can detect the presenceand location of touch, e.g., by a finger, or passive object such as astylus or digital pen, are commonly referred to as a touch screens.Touch screens have become a component of many computer and electronicdevices. Many LCD displays are manufactured to include touch screenfunctionality. Touch screens can be attached or incorporated into tocomputers, networks, mobile telephones, video games, personal digitalassistants (PDA), tablets, or any digital device. A variety oftechnologies are currently used to produce a device with touch screencapabilities. Technologies that enable touch screen functionalityinclude: resistive touch screen panels; surface acoustic wavetechnology; capacitive sensing panels (e.g., using surface capacitancetechnology or projective capacitive touch technology, which uses eithermutual capacitive sensors or self-capacitive sensors); infrared; opticalimaging; dispersive signal technology; and acoustic pulse recognition.Touch screen functionality can be combined with a display in a device inmany configurations. The touch screen sensing circuits can beincorporated directly in or on the layers of the display (using, forexample, “in-cell” or “on-cell” approaches), built on a separatesubstrate which is laminated onto the display (e.g., using an “out-cell”approach), or laminated on a cover lens which protects the display inthe device, or the sensing circuits can be incorporated directly on theback-side of this cover lens (“Touch-on-Lens”).

As will be appreciated by those skilled in the art, electronic devicescan be configured to include a variety of components and featuresincluding: a display, a touch screen, a scratch-resistant cover (e.g.,lens), storage, a system on a chip, a CPU core, a GPU core, memory,Wi-Fi connectivity (e.g., 902.11 b.g), Bluetooth, connectivity (e.g.,USB connector), camera, audio, battery (e.g., built-in, rechargeablelithium-ion polymer battery), power connector, computer readable media,software, etc.

For purposes of illustrating an integrated sensor of the disclosuresuitable for detecting a fingerprint, a touch screen display currentlyemployed by, for example, a smart phone is described. Such a touchscreen typically comprises a 9 cm (3.5 in) liquid crystal display (LCD)with a scratch-resistant glass layer. The capacitive touch screen of theLCD is typically optimized for a bare finger, or multiple fingermulti-touch, sensing. However, as will be appreciated by those skilledin the art, a variety displays as well as a variety of touch screenconfigurations and touch screen operated devices can be used withoutdeparting from the scope of the disclosure.

An LCD touch screen typically is an assembly that includes an LCD, aprinted circuit board (PCB) on which input-output (I/O) connections andintegrated circuits (ICs) performing various functions are mounted, atransparent touch screen circuit pattern on a transparent substrate, anda protective shield or coating applied on top of the touch screencircuitry. The touch screen circuitry is connected along with the LCDdisplay to the PCB. The touch screen circuitry is typically incorporatedinto the assembly using one of two methods. In a first method, the touchscreen circuitry is incorporated directly into or onto the LCD, then aprotective shield or coating (e.g. cover lens) is located above theLCD/Touch screen combination. In a second method, the touch screencircuitry is applied onto the protective coating or shield (e.g. coverlens) and then the resulting structure is mounted above the LCD, withthe touch screen circuitry mounted between the protective coating orshield and the LCD. In all cased the PCB is located below the LCD, outof view.

Biometric sensors can include, for example, a fingerprint sensor, avelocity sensor, and an integrated circuit which is electricallyconnected to the fingerprint sensor and the velocity sensor. Conductivetraces of an image sensor and velocity sensor can be etched or otherwiseformed on an upper side of a substrate. A protective coating can beapplied to the upper surface of the substrate, over the image sensor andvelocity sensor to provide electrical isolation and mechanicalprotection of the sensors. Alternatively, conductive traces of an imagesensor can be formed on a bottom-side of a substrate, wherein thesubstrate can act as a protective coating and can be further improvedwith a hard coating applied to the upper surface. Further details aboutfingerprint sensor configurations are contained in, for example, U.S.Pat. No. 7,751,601 to Benkley III for “Fingerprint Sensing Assembliesand Methods of Making”; U.S. Pat. No. 7,099,496 to Benkley III for“Swiped Aperture Capacitive Fingerprint Sensing Systems and Methods;”U.S. Pat. No. 7,463,756 to Benkley III for “Finger Position SensingMethods and Apparatus;” U.S. Pat. No. 7,460,697 to Erhart et al. for“Electronic Fingerprint Sensor with Differential Noise Cancellation;”U.S. Pat. No. 7,146,024 to Benkley III for “Swiped Aperture CapacitiveFingerprint Sensing Systems and Methods;” U.S. Pat. No. 6,400,836 toSenior for “Combined Fingerprint Acquisition and Control Device;” andU.S. Pat. No. 6,941,001 to Bolle for “Combined Fingerprint Acquisitionand Control Device.”

In the systems disclosed herein, a fingerprint sensor is integrated witha display and is positioned on or adjacent the uppermost surface suchthat the fingerprint sensor is within about 150 microns of a finger whenthe finger comes in contact with the uppermost surface of the system. Inat least some configurations, the system can be configured such that thefinger sensor is within about 100 microns of a finger, or morepreferably within 50 microns of a finger, when the finger comes incontact with the uppermost surface of the system. In someconfigurations, a single chip can be provided that controls one or moreof the display, touch screen and the fingerprint sensing functions.Additionally, the fingerprint sensor can be incorporated in such a waythat the surface of the device presented to a user is smooth orsubstantially smooth. Displays and systems can be configured such thatthey are integrally formed such that they act in a unified manner orsuch that the completed display or system is comprised of a singlecomponent.

FIG. 1 is an electronic device 100 from a top or upper surface view. Thedevice is any suitable electronic device, such as a smart phone, havinga device or display interface 120 which a user engages with theirfinger. Depending upon the nature of the device and display used, theinterface 120 can further be comprised of a plurality of parts, asdiscussed in further detail below.

The device itself has a top surface 102 and a bottom surface 104.Moreover, each component of the device has an upper surface (i.e. asurface that faces the top surface of the device) and a lower surface(i.e. a surface that faces the bottom surface of the device) as will beappreciated from the cross-sectional views. The housing 110 of theelectronic device 100 can be configured to form a bezel or rim 112 whichsecures the interface 120 within the housing 110 of the device 100. Amask 124, such as an ink mask, can be provided which frames at leastpart of the interface 120. The mask 124 is typically positioned suchthat it obscures device electronics located within the housing under aportion of the interface 120. For a touch screen enabled interface, aportion of the interface 120 that is not covered by mask 124 has aplurality of touch screen sensors 134. The plurality of touch screensensors 134 can be any suitable conductor, including a transparentconductor, for example, from a layer of patterned indium tin oxide(ITO), carbon nanotubes, metal nanowires, conductive polymers or finemetal lines (e.g., copper lines). Additionally, a fingerprint sensor 140adjacent at least one wall of the electronic device 100 and can (asillustrated here), but need not, be positioned in a location where themask 124 is also present. In another configuration, an aperture can beprovided in the mask corresponding to all or part of a location wherethe fingerprint is sensed. The fingerprint sensor 140 can include aswiping area 146 across which, for example, a user would swipe theirfingerprint which is then read by the fingerprint sensor 140.

As shown in FIG. 1b the fingerprint sensor 140 is positioned such thatit overlays a portion of the touch screen sensor 134. In someconfigurations, the sensors of the fingerprint sensor 140 and the touchscreen sensor 134 are integrally formed such that the sensors are formedas one piece or are formed such that the sensors act in a unified mannerwith portions of the sensor adapted to function as a touch screen sensorand a subset adapted to function as a fingerprint sensor or afingerprint sensor and a touch screen sensor.

FIGS. 2a-b are cross-sectional views of an electronic device 200, suchas device 100 of FIG. 1a , taken along the lines 2-2 of FIGS. 1a-b .Although not exhaustive, two common cross-sectional configurationsexist. In a first configuration shown in FIG. 2a , a fingerprint sensoris positioned on a cover lens, below which is a touch sensor, and theremainder of the device, including the display. In the secondconfiguration, shown in FIG. 2b the fingerprint sensor is positioned ontop of the cover lens and the touch sensor is built onto the back side(lower side) of the cover lens, with the display and the rest of thedevice below. As will be appreciated by those skilled in the art, one ormore components can be configured into a module. Modules can beconfigured as separable components, interchangeable with others, forassembly into units of differing size, complexity, or function

Electronic device 200 includes a housing 210, a printed circuit board(PCB) 230 and a display 228, such as an LCD or LCD module. The devicecan also include a touch sensor component 235, such as a glass layer,onto which a conductive layer such as indium tin oxide (ITO) or similarmaterials are applied to form the touch screen circuitry. The conductivelayer can be applied such that it forms a pattern on the surface of theglass layer, as will be appreciated by those skilled in the art. Asshown in FIG. 2a , a first conductive layer 234 covers an upper surface206 of the touch sensor component 253 and a second conductive layer 234′covers a lower surface 208 of the touch sensor component 235. The coverlens 238 can be formed from suitable material including, for example, achemically hardened glass. A touch circuit controller 226 is coupled toa touch screen circuit or digitizer which can be formed from conductivelayers 234, 234′ of the touch circuit component 235 via a flexiblecircuit 232. The controller 226 is mountable on the PCB 230. A display228 is positioned below the cover lens 238 and above the PCB 230. Thedisplay 228 can include, for example, a glass layer as well as any othercomponents required to achieve a functional display including logicdevices.

As depicted herein a fingerprint sensor 240 is, but need not be,positioned underneath a mask 224. The sensor 240 is illustratedconnected to a fingerprint sensor circuit controller 262 via a flexibleconnector 260. However, as will be appreciated by those skilled in theart, a single integrated circuit can be configured to control both thetouch circuit and the fingerprint sensor without departing from thescope of the disclosure. A protective layer 222, such as a protectiveglass layer, is positioned over the fingerprint sensor 240 and thedisplay 228.

Fingerprint sensor 240 senses fingerprint characteristics of a fingerswiped along the surface of protective layer 222 proximate thefingerprint sensor 240. The protective layer 222 and display layer 228can be formed from any suitable non-conductive material (e.g., glass,PET or a suitable hard coating). Fingerprint sensor 240 is adapted andconfigured such that it is capable of sensing ridges and valleys of auser's finger at or within a target distance from the device surface.The target distance is less than 150 microns, more particularly is lessthan 100 microns, and even more particularly is less than 50 microns.

Turning to FIG. 2b , which illustrates an alternative cross-section ofthe device shown in FIG. 1a , electronic device 200 includes a housing210, a PCB 230 and a display module 228. Where touch screenfunctionality is included, device 200 can also be configured such thatthe conductive layer 234 is shown as applied to a lower side of coverglass 238. Device 200 further includes a protective layer 222 positionedabove cover glass 238. A touch screen circuit controller 226 is coupledto a conductive layer via a flexible circuit or connector 232. Afingerprint sensor controller 262 is coupled to PCB 230 and positionedbelow display 228. Fingerprint sensor 240 is positioned near the uppersurface of the cover lens and is adapted and configured to sensefingerprint characteristics of a finger swiped along the surface ofprotective layer 222 proximate the fingerprint sensor.

FIG. 3 is a top view of an interface 320 of a display having a mask 324layered thereon and flex section 332 adapted and configured toelectrically engage the conductor and a suitable integrated circuit(IC), application-specific integrated circuit (ASIC) or chip.

FIGS. 4a-b are exploded views of display devices shown in FIGS. 2a-b .FIG. 4a has a first layer comprising a PCB layer 430 onto which one ormore controllers are affixed. The controller can be one or moreintegrated circuit chips adapted and configured to control one or moreof the devices such as the display and the fingerprint sensor. As shownin FIG. 4a an integrated controller 426 is provided for the touch screenand an integrated circuit 462 is provided for the finger print sensor.The next layer is the display 428 layer. Where the device includes touchscreen capability, the next layer is the touch screen layer 435 which,as depicted in this configuration, has a first conductive layer 434 on afirst side (upper surface 406) of the touch screen layer, and a secondconductive layer 434′ on the second surface (lower surface 408) of thetouch screen layer. The fingerprint sensor 440 is positioned on theupper surface 406 of the cover lens 438 and may be partially or fullycovered by a mask layer 424 which selectively covers the cover lens 438.A protective layer 422 is positioned over the entire assembly.

FIG. 4b again has a first layer comprising a PCB layer 430 onto whichone or more controllers are affixed. The controller can be one or moreintegrated circuit chips adapted and configured to control one more ofthe display, the touch screen sensor, the fingerprint sensor, etc. Asshown in FIG. 4b an integrated controller 426 is provided for the touchscreen and an integrated circuit 462 is provided for the finger printsensor. The next layer is the display 428 layer. Where the deviceincludes touch screen capability, the next layer is the touch screenlayer 435 which, as depicted in this configuration, has a firstconductive layer 434 on the second surface (lower surface 408) and isformed directly on the cover lens. The fingerprint sensor 440 ispositioned on the upper surface 406 of the cover lens 438 and may bepartially or fully covered by a mask layer 424. The mast 424 can have anaperture 425 over all or a portion of the display corresponding to thefingerprint sensor. A protective layer 422 is positioned over the entireassembly.

FIG. 5a illustrates layers of a fingerprint sensor 540 adaptable andconfigurable for integration with a display, as described above. Thefingerprint sensor 540 is shown in cross-section along the lines 5-5shown in FIG. 1. The fingerprint sensor 540 has a patterned conductorlayer 548. An uppermost layer is a flexible film that functions as aprotective layer 522. A suitable film is, for example, polyethyleneterephthalate (PET) or any suitable hardened thermoplastic polymerresin, which may also have a hard coat on top. The film has a thicknessof less than 50 microns to enable effective operation of the fingerprintsensor 540. A mask 524 is positionable on the bottom surface 508 of thefilm and may be deposited on the film on the lower (bottom) surface. Themask 524 may be a suitable ink layer. The next layer forms part of thefingerprint sensor 540 and is a conductive layer, typically atransparent conductor or patterned transparent conductor 548. Thetransparent conductor 548 forms a first metal layer and may be formedfrom any suitable conductive material including, for example, indium tinoxide (ITO), carbon nanotubes, metal nanowires or fine line metal. Asecond metal 548′ layer can be provided that overlaps at least a portionof the first metal layer 548. The conductive layer 548, 548′ ispositioned on the bottom (interior facing) side of the film. In someconfigurations of the fingerprint sensor with display an optical coatinglayer 550 can be provided to reduce or prevent reflection and to assistin hiding the conductive layer. An adhesive layer 552 adheres the fingerprint sensor 540 conductive layer 548, the film and the mask to thecover glass 538. The adhesive layer 552 is typically an optically clearadhesive. The second metal layer 548′ is flexible and with the film 522can wrap-around the edge of the cover lens 538. As depicted the secondmetal layer 548′ can be formed in electrical communication to a flex 560which has a chip 562 mounted thereon. The flex 560 and chip 562 can beprovided pre-assembled as a chip-on-flex (COF). By providing a microchipdirectly mounted on and electrically connected to a flexible circuit,COF can be electrically connected to the second metal layer and thenshaped into the device package as needed. However, as will beappreciated by those skilled in the art, other configurations ofconnecting the chip via a flexible connector can be employed withoutdeparting from the scope of the disclosure. In some configurations, theconductor 548 is integrally formed with the touch screen. Additionally,a touch sensor can be positioned as illustrated in FIGS. 2a-b . However,as will be appreciated by those skilled in the art, in someconfigurations a flexible lead may be used instead of a COFconfiguration.

FIG. 5b illustrates the configuration shown in FIG. 5a wherein the filmhas the mask applied, and has the conductive layer applied. Thereafterthe optional second conductive layer is applied. If an optical coatinglayer is used, then the optical layer can be applied on the film surfaceor another appropriate surface to enhance optical performance. From thatpoint the lens can be adhered to the optical coating or conductivelayer, followed by electrically connecting the COF to the conductivelayer. As will be appreciated by those skilled in the art, the step ofadhering the lens can be performed before or after the step of attachingthe COF. In some configurations, the lens can have a rounded end tofacilitate bending the film around the lens for mounting within thedevice housing. The completed apparatus is then positioned within adevice housing 510 adjacent an edge such that the upper surface is flushwith upper surface of the housing or is flush with the overall displayapparatus as shown in FIG. 2 a.

FIG. 6a illustrates a fingerprint sensor 640 having two metal layers onthe top side of a film. The first layer is a protective layer such ashard coat 622. The hard coat has a thickness of less than 50 microns toenable effective operation of the fingerprint sensor. A mask 624 ispositioned next to or under the bottom surface of the film. The mask 624may be a suitable ink layer. A first conductive layer 648 is providednext. The conductive layer 648, is typically a transparent conductor orpatterned transparent conductor. The transparent conductor 648 forms afirst metal layer and may be formed from any suitable conductivematerial including, for example, indium tin oxide (ITO), carbonnanotubes, or fine line metal. The conductive layer is positioned on thebottom (interior facing) side of the film. A second conductive layer,648′, is formed which connects with the first conductive layer. Thesecond conductive layer can be formed from any suitable transparentconductor, such as copper. A layer of film 664 is adhered to a coverlens 638 of the display by a layer of adhesive 652. The adhesive layer652 is typically an optically clear adhesive. As depicted the secondmetal layer 648′ can be formed in electrical communication with a flex660 which has a chip 662 mounted thereon. The flex 660 can be positionedon the upper side of the second metal layer 648′. In someconfigurations, the conductor 648 is integrally formed with the touchscreen sensor.

FIG. 6b illustrates the layers of FIG. 6a within a device housing 610.The film 664, flex 660, and chip 662 can be bent around, for example,the cover lens 638 to facilitate positioning the chip within the housingof the device. The cover lens 638 can be provided with a rounded edge inorder to facilitate bending the film 664 around the lens. In assemblingthe components, the conductor is pattered onto the clear plastic film(PET) layer and then the second conductive layer is patterned on top ofa portion of the first conductive layer. A mask is then applied and aprotective layer is added. Thereafter the cover glass, or lens, of thedisplay can be adhered to the bottom surface of the clear plastic filmand the flex can be adhered to the upper surface of the secondconductive layer.

FIG. 7a illustrates layers of a fingerprint sensor 740 having a flexibletransparent conductor on the bottom-side of a film. The first layer is afilm such as PET with a hard coat on top 722. The film has a thicknessof less than 150 microns to enable effective operation of thefingerprint sensor, and more preferably a thickness of less than 100microns, and even more preferably less than 50 microns. A mask 724 ispositioned next and may be deposited on the film on the surface of thetopcoat facing into the device housing and away from the exterior of thedevice. The mask 724 may be a suitable ink layer. A conductive layer 748of flexible material capable of being wrapped around a surface,typically a transparent conductor or patterned transparent conductor isprovided. The conductive layer 748 may be formed from any suitableflexible conductive material including, for example, carbon nanotubes,metal nanowires, conductive polymers and fine line metal. The conductivelayer is positioned on the bottom (interior facing) side of the film. Ananti-reflective or index-matching coating 750 may optionally be addedonto the cover lens, film, or other appropriate layer. The adhesivelayer 752 adheres the film, patterned conductors and ink to the coverglass 738, and is typically an optically clear adhesive. The conductivelayer 748 is formed in electrical communication with a flex 760 whichhas a chip 762 mounted thereon. The flex 760 is positioned on the bottomside of the conductive layer and connects the conductive layer throughthe flexible circuit to the chip.

FIG. 7b illustrates the layers of the sensor 740 of FIG. 7a within ahousing 710. In assembling the components, a mask is applied to thefilm, then the conductor is pattered onto the film and mask layers.Thereafter the cover glass, or lens, of the display can be adhered tothe bottom surface of the clear plastic film and the flex can be adheredto the upper surface of the conductive layer.

FIG. 8a illustrates layers of a fingerprint sensor 840 using a flexibletransparent conductor on the top-side of a film. A hard coat 822 isprovided which is positioned over a mask 824. A patterned conductivelayer 848 of flexible material is provided which is in electricalcommunication with a COF assembly comprising a flex 860 and chip 862. Aclear plastic film 864 is also be provided, such as a PET layer, whichcan be adhered to a cover glass or cover lens 838 via an adhesive 852.

FIG. 8b illustrates the layers the sensor 840 of FIG. 8a within ahousing 810. In assembling the components, the conductor is patteredonto the clear plastic film (PET). A mask is then applied and aprotective layer or hard coat is added. Thereafter the cover glass, orlens, of the display can be adhered to the bottom surface of the clearplastic film and the flex can be adhered to the upper surface of theconductive layer.

FIG. 9a illustrates layers of a fingerprint sensor 940 suitable forintegration with a display. An ultrathin glass layer 923 is providedover a mask 924. A patterned conductive layer 948 of flexible materialis then applied. The patterned conductive layer 948 is electricallyconnected to a flex assembly via an anisotropic conductive film (ACF)966. The flex assembly includes a flex 960 and a chip 962. In betweenthe patterned conductive layer 948 and the chip 962, a cover lens 938 ispositioned which is adhered to the conductive layer via a suitableadhesive 952. The flex assembly is configured to wrap around an end ofthe cover glass.

FIG. 9b illustrates the layers of the fingerprint sensor shown in FIG.9a positioned within a housing 910. In assembling the components, a maskis applied to the bottom surface of the ultrathin glass layer. Apatterned conductive layer is then applied to the ultrathin glass/maskcombination. A anisotropic conductive film is then applied to one end ofthe layers to which a COF is adhered. The cover glass or lens is thenadhered to the patterned conductive layer and the flexible circuit ofthe COF is wrapped around and end of the lens

FIG. 10a illustrates layers of a fingerprint sensor 1040 formed via adirect build-up of patterned conductors on a lens. A hard coating 1023is provided over a mask 1024. A planarization layer 1068 can also beprovided. A flex assembly includes a flex connector 1060 and a chip1062. An end of the flex assembly is connected to a lens or cover glass1038, which has been patterned with a conductive layer 1048, via an ACF1066.

FIG. 10b illustrates the layers of the fingerprint sensor shown in FIG.10a positioned within a housing 1010. In assembling the components, thelens has a conductive layer patterned onto an upper surface. An ACF isapplied at one end of the layer, to which a flexible circuit of a COF isadhered. A planarization layer can then be applied to the upper surface,followed by a mask layer, and a protective hard coating. The flexiblecircuit of the COF is wrapped around the lens to facilitate positioningthe circuit below the lens within the device housing.

FIG. 11 illustrates a portion of a display which uses conductive leads1134, such as metal leads, printed to wrap-around a lens 1148 of adisplay.

FIG. 12a illustrates the use of wrap-around leads in a direct build-upapproach of a fingerprint sensor 1240. A protective layer such as hardcoating 1223 is positioned over a mask 1224. A planarization layer 1268can also be provided which is positioned over a patterned conductivelayer 1248. The cover lens 1238 has a conductive lead 1234 wrappedaround an end which engages a flex 1260 having a chip 1262 via an ACF1266. FIG. 12b illustrates the layers of FIG. 12a within a housing 1210.

FIG. 13a illustrates the use of wrap-around leads in an ultrathin glassapproach of a fingerprint sensor 1340. A protective layer such asultrathin glass 1322 is provided which covers a mask 1324. A patternedconductive layer 1348 is positioned over an optional optical coat 1350.A cover lens 1338 of a display is provided which has a wrap around leadprinted thereof. The lens can be adhered to the optical coat 1350 (ifpresent), the patterned conductive layer, the mask and the ultrathinglass via an adhesive 1352. A flex 1360 having a chip 1362 can beconnected to the wrap around leads of the cover glass or lens via an ACF1366. FIG. 13b illustrates the layers of FIG. 13a within a housing.

FIG. 13a illustrates the use of wraparound leads in an ultrathin glassapproach of a fingerprint sensor 1340. A protective layer such asultrathin glass 1322 is provided which covers a mask 1324. A patternedconductive layer 1348 is positioned over an optional optical coat 1350.A cover lens 1338 of a display is provided which has a wraparound leadprinted thereof. The lens can be adhered to the optical coat 1350 (ifpresent), the patterned conductive layer, the mask and the ultrathinglass via an adhesive 1352. A flex 1360 having a chip 1362 can beconnected to the wrap around leads of the cover glass or lens via an ACF1366. FIG. 13b illustrates the layers of FIG. 13a within a housing. Thedisclosed fingerprint sensors may include a fingerprint image sensor,which may include in conductive layers 548, 648, 748, 848, 948, 1048,1248 and 1348, as shown in FIGS. 5a-b-10a-b, and 12a-b and 13a-b , andan array of capacitive sensors for capacitive sensing of ridge peaks andridge valleys of a fingerprint on a swiped finger. The image sensors548, 648, 748, 848, 948, 1048, 1248 and 1348 may include a linear arrayof capacitive sensors for capacitive sensing of ridge peaks and ridgevalleys of a fingerprint. The image sensors may also include at leastone image pickup trace and at least one image drive traces in spacedrelation to the at least one image pickup plate to each definerespectively one of a plurality of sensor gaps/image pixel locations,between a respective image drive plate and a respective image pickupplate. The ridge peaks and ridge valleys of the fingerprint over thesensor gaps/image pixel locations can produce a change in capacitancebetween the respective image drive trace and the respective image pickuptrace. The conductive elements/traces may thus create a capacitivesensing array for detecting topographic variations in an object, such asa finger. The array may include multiple drive traces which can besequentially excited with short duration electronic waveform bursts. Apickup plate connected to a charge sensing circuit can sequentiallydetect/receive the intensity of the electric field created by arespective drive trace. With each complete scan of the pixel locationsformed by the drive/pickup trace gaps a two-dimensional image based onvariation of capacitance across the respective gaps can be generated,including a resemblance of features of the physical surface of theobject. In some embodiments, the sensor drive traces can compriseparallel traces/conductors disposed perpendicular to a single imagepickup trace and spaced from the image pickup trace by respective sensorgaps. In some embodiments, two or more image pickup traces can beutilized. The image pickup trace(s) and the image drive trace(s) may besubstantially coplanar in the sensor conductive layers 548, 648, 748,848, 948, 1048, 1248 and 1348. Features of the finger passing above thesensor gaps so created in the sensor conducive layers 548, 648, 748,848, 948, 1048, 1248 and 1348 can produce changes in capacitance betweeneach respective image drive trace(s) and a respective image pickuptrace(s). The image sensing apparatus, e.g., a controller IC 562, 662,762, 862, 962, 1062, 1262 and 1362, may further comprise an excitationcircuit for sequentially energizing the respective image drive trace(s)with image drive signals and a detection circuit for detecting the drivesignals capacitively coupled, i.e., received from the respective imagedrive trace(s) by the respective image pickup trace(s), across therespective gap, to provide image signals. Therefore the conductivelayers 548, 648, 748, 848, 948, 1048, 1248 and 1348 can form capacitivegap sensor arrays for detecting topographic variations of an object overthe array. The sensor arrays having the described sensor gaps, i.e.,sensor apertures can sense topographic variations in the object, e.g.,over or passing over the respective sensor gap/aperture, because thecapacitance of the capacitive gap/aperture changes and can be measuredto reconstruct an image of the biometric being sensed.

Sensing device 1400 further includes a readout circuit 1454 for readinganalog output signals from sensor element 1402 when it is subject to afingerprint juxtaposed on a sensor surface 1407. Readout circuit 1454includes an amplifier 1456 configured to amplify the analog signal sothat it can more accurately be read in subsequent operations. A low passfilter 1458 is configured to filter out any noise from the analog signalso that the analog signal can be more efficiently processed. Readoutcircuit 1454 further includes an analog-to-digital (A/D) converter 1460that is configured to convert the output signal from sensor element 1402to a digital signal that indicates a series of logic 0's and 1's thatdefine the sensing of the fingerprint features by the pixels or datacontact points of sensor surface 1407. Such signals may be separatelyreceived by the motion sensors and the fingerprint sensing surfaces, andmay be read out and processed separately.

Readout circuit 1454 may store the output signal in a storage 1462,where fingerprint data 1464 is stored and preserved, either temporarilyuntil a processor 1466 can process the signal, or for later use by theprocessor. Processor 1466 includes an arithmetic unit 1468 configured toprocess algorithms used for navigation of a cursor, and forreconstruction of fingerprints. Processing logic 1470 is configured toprocess information and includes analog to digital converters,amplifiers, signal filters, logic gates (all not shown) and other logicutilized by a processor. A persistent memory 1474 is used to storealgorithms 1476 and software applications 1478 that are used byprocessor 1466 for the various functions described above, and in moredetail below. A system bus 1480 is a data bus configured to enablecommunication among the various components contained in sensing device1400. As will be appreciated by those skilled in the art, memory andstorage can be any suitable computer readable media.

The system further includes a controller communicating with thefingerprint sensor lines to capture a fingerprint image when a user'sfingerprint is swiped about the fingerprint sensor lines. In one system,there may be separate controllers for both the display and thefingerprint sensor, where the system is configured to include a displaycontroller configured to control the visible display separate from thefingerprint sensor operations. Alternatively, a single controller may beused to control, for example, the visible display and the fingerprintsensor operations. The fingerprint sensor could also be patterned ontothe top glass of the display itself, and not onto a touch-screen layer.

FIG. 15 illustrates the use of a fingerprint sensor according to thedisclosure within a communication network. As will be appreciated bythose skilled in the art, the present disclosure may also involve anumber of functions to be performed by a computer processor, such as amicroprocessor, and within a communications network. The microprocessormay be a specialized or dedicated microprocessor that is configured toperform particular tasks according to the disclosure, by executingmachine-readable software code that defines the particular tasksembodied by the disclosure. The microprocessor may also be configured tooperate and communicate with other devices such as direct memory accessmodules, memory storage devices, Internet related hardware, and otherdevices that relate to the transmission of data in accordance with thedisclosure. The software code may be configured using software formatssuch as Java, C++, XML (Extensible Mark-up Language) and other languagesthat may be used to define functions that relate to operations ofdevices required to carry out the functional operations related to thedisclosure. The code may be written in different forms and styles, manyof which are known to those skilled in the art. Different code formats,code configurations, styles and forms of software programs and othermeans of configuring code to define the operations of a microprocessorin accordance with the disclosure will not depart from the spirit andscope of the disclosure.

Within the different types of devices, such as laptop or desktopcomputers, hand held devices with processors or processing logic, andalso possibly computer servers or other devices that utilize thedisclosure, there exist different types of memory devices for storingand retrieving information while performing functions according to thedisclosure. Cache memory devices are often included in such computersfor use by the central processing unit as a convenient storage locationfor information that is frequently stored and retrieved. Similarly, apersistent memory is also frequently used with such computers formaintaining information that is frequently retrieved by the centralprocessing unit, but that is not often altered within the persistentmemory, unlike the cache memory. Main memory is also usually includedfor storing and retrieving larger amounts of information such as dataand software applications configured to perform functions according tothe disclosure when executed by the central processing unit. Thesememory devices may be configured as random access memory (RAM), staticrandom access memory (SRAM), dynamic random access memory (DRAM), flashmemory, and other memory storage devices that may be accessed by acentral processing unit to store and retrieve information. During datastorage and retrieval operations, these memory devices are transformedto have different states, such as different electrical charges,different magnetic polarity, and the like. Thus, systems and methodsconfigured according to the disclosure as described herein enable thephysical transformation of these memory devices. Accordingly, thedisclosure as described herein is directed to novel and useful systemsand methods that, in one or more embodiments, are able to transform thememory device into a different state. The disclosure is not limited toany particular type of memory device, or any commonly used protocol forstoring and retrieving information to and from these memory devices,respectively.

A single medium or multiple media (e.g., a centralized or distributeddatabase, and/or associated caches and servers) that store one or moresets of instructions can be used. Any medium, such as computer readablemedia, that is capable of storing, encoding or carrying a set ofinstructions for execution by a machine and that causes the machine toperform any one or more of the methodologies of the disclosure issuitable for use herein. The machine-readable medium, or computerreadable media, also includes any mechanism that provides (i.e., storesand/or transmits) information in a form readable by a machine (e.g., acomputer, PDA, cellular telephone, etc.). For example, amachine-readable medium includes memory (such as described above);magnetic disk storage media; optical storage media; flash memorydevices; biological electrical, mechanical systems; electrical, optical,acoustical or other form of propagated signals (e.g., carrier waves,infrared signals, digital signals, etc.). The device or machine-readablemedium may include a micro-electromechanical system (MEMS),nanotechnology devices, organic, holographic, solid-state memory deviceand/or a rotating magnetic or optical disk. The device ormachine-readable medium may be distributed when partitions ofinstructions have been separated into different machines, such as acrossan interconnection of computers or as different virtual machines.Moreover, the computer readable media can be positioned anywhere withinthe network.

FIG. 15 illustrates an exemplary illustrative networked computingenvironment 1500, with a server in communication with client computersvia a communications network 1550. As shown in FIG. 15, server 1510 maybe interconnected via a communications network 1550 (which may be eitherof, or a combination of a fixed-wire or wireless LAN, WAN, intranet,extranet, peer-to-peer network, virtual private network, the Internet,or other communications network) with a number of client computingenvironments such as tablet personal computer 1502, mobile telephone,smart phone 1504, telephone 1506, personal computer 1503, and personaldigital assistant 1608. In a network environment in which thecommunications network 1550 is the Internet, for example, server 1510can be dedicated computing environment servers operable to process andcommunicate data to and from client computing environments via any of anumber of known protocols, such as, hypertext transfer protocol (HTTP),file transfer protocol (FTP), simple object access protocol (SOAP), orwireless application protocol (WAP). Other wireless protocols can beused without departing from the scope of the disclosure, including, forexample Wireless Markup Language (WML), DoCoMo i-mode (used, forexample, in Japan) and XHTML Basic. Additionally, networked computingenvironment 1600 can utilize various data security protocols such assecured socket layer (SSL) or pretty good privacy (PGP). Each clientcomputing environment can be equipped with operating system 1538operable to support one or more computing applications, such as a webbrowser (not shown), or other graphical user interface (not shown), or amobile desktop environment (not shown) to gain access to servercomputing environment 1500.

As will be appreciated by those skilled in the art, any of the deviceswithin the communication network 1550 that have a display (e.g.,computer 1501, smart phone 1508, and PDA 1508) can be configured toacquire data from a fingerprint sensor, as described above. Additionallyinformation from the fingerprint sensors can then be transmitted toother devices within the network to facilitate authentication of a userwithin a network environment regardless of whether the receiving devicehad a display.

The devices disclosed herein can be used as part of a communicationnetwork to provide a mechanism for authenticating biometric information.For example, biometric information can be sensed that is associated witha user; the sensed information can then be compared with a biometrictemplate associated with the user; if the biometric information matchesthe biometric template, credentials associated with the user can bereceived based on the biometric information. Additionally, credentialscan be communicated, for example, to a requesting process. In anotherprocess, a biometric device installed in a client device with aweb-enabled application can be identified. Thereafter biometricinformation associated with a user is identified whereupon a biometrictemplate associated with the biometric information of the user iscreated. The system can be configured to receive user credentialsassociated with the user and to bind the user credentials with thebiometric template. A web browser application can also be provided thatis executable on the devices disclosed which includes a biometricextension configured to communication with the sensors disclosed via,for example, a biometric service and one or more web servers. Tokens canalso be used to identify a valid user activation as part of theoperation of the disclosed devices.

The use of integratable sensors facilitates the use of, for example, aweb browser application that is configured on a client device andconfigured to be executed by a client processor on the device tofacilitate conducting a secure transaction, such as a financialtransaction, remotely which is authenticated based on informationacquired by an integratable sensor such as those disclosed.

While preferred embodiments of the present invention have been shown anddescribed herein, it will be obvious to those skilled in the art thatsuch embodiments are provided by way of example only. Numerousvariations, changes, and substitutions will now occur to those skilledin the art without departing from the invention. It should be understoodthat various alternatives to the embodiments of the invention describedherein may be employed in practicing the invention. It is intended thatthe following claims define the scope of the invention and that methodsand structures within the scope of these claims and their equivalents becovered thereby.

What is claimed is:
 1. A system, comprising: a cover glass; afingerprint sensor formed of direct build-up patterned conductorsdisposed on the cover glass, wherein the direct build-up patternedconductors are passive traces forming an image sensing array ofcapacitively coupled drive elements and pick up elements; a flexibleconnector connected to the patterned conductors; a chip mounted on theflexible connector, the chip being configured to control the fingerprintsensor, wherein the chip comprises an excitation circuit for energizingthe drive elements and a detection circuit for detecting correspondingsignals received from the pickup elements; and a display module belowthe cover glass, the display module being configured to produce avisible display.
 2. The system of claim 1, wherein the cover glass isformed from a chemically hardened glass.
 3. The system of claim 1,further comprising: a touch sensor below the cover glass.
 4. The systemof claim 3, wherein the fingerprint sensor is positioned such that itoverlays a portion of the touch sensor.
 5. The system of claim 1,further comprising: a protective layer positioned over the cover glassand the fingerprint sensor.
 6. The system of claim 5, wherein theprotective layer is a protective glass layer.
 7. The system of claim 5,wherein the protective layer is a flexible film.
 8. The system of claim1, wherein the fingerprint sensor is positioned on an upper surface ofthe cover glass.
 9. The system of claim 1, wherein the fingerprintsensor is formed of transparent patterned conductors.
 10. The system ofclaim 1, wherein the fingerprint sensor is fully or partially covered bya mask layer.
 11. The system of claim 1, wherein the display modulecomprises a glass layer.
 12. The system of claim 1, wherein the flexibleconnector and the chip form a chip-on-flex (COF) structure.
 13. Thesystem of claim 1, further comprising: a touch sensor, wherein the chipis further configured to control the touch sensor and the displaymodule.
 14. The system of claim 1, wherein the chip is positioned belowthe cover glass.
 15. The system of claim 1, wherein the flexibleconnector is attached at an upper surface of the cover glass, and theflexible connector is wrapped around the cover glass to position thechip below the cover glass.
 16. The system of claim 1, wherein theflexible connector is attached at a lower surface of the cover glass,and the chip is positioned below the cover glass.
 17. A systemcomprising: a cover glass configured to protect a display module belowthe cover glass, the display module being configured to produce avisible display; a fingerprint sensor formed of direct build-uppatterned conductors disposed on the cover glass, wherein the directbuild-up patterned conductors are passive traces forming an imagesensing array of capacitively coupled drive elements and pick upelements; and a chip, connected to the fingerprint sensor, the chipbeing configured to control the fingerprint sensor, wherein the chipcomprises an excitation circuit for energizing the drive elements and adetection circuit for detecting corresponding signals received from thepickup elements.
 18. The system of claim 17, wherein the cover glass isformed from a chemically hardened glass.
 19. The system of claim 17,further comprising: a protective layer positioned over the cover glassand the fingerprint sensor.
 20. The system of claim 19, wherein theprotective layer is a protective glass layer.
 21. The system of claim19, wherein the protective layer is a flexible film.
 22. The system ofclaim 17, wherein the fingerprint sensor is positioned on an uppersurface of the cover glass.
 23. The system of claim 17, wherein thefingerprint sensor is formed of transparent patterned conductors. 24.The system of claim 17, further comprising: a flexible connectorconnected to the patterned conductors; and wherein the chip is mountedon the flexible connector.
 25. The system of claim 24, wherein theflexible connector and the chip form a chip-on-flex (COF) structure. 26.The system of claim 24, wherein the chip is positioned below the coverglass.
 27. The system of claim 24, wherein the flexible connector isattached at an upper surface of the cover glass, and the flexibleconnector is wrapped around the cover glass to position the chip belowthe cover glass.
 28. The system of claim 24, wherein the flexibleconnector is attached at a lower surface of the cover glass, and thechip is positioned below the cover glass.
 29. The system of claim 17,further comprising: a touch sensor below the cover glass.
 30. The systemof claim 29, wherein the fingerprint sensor is positioned such that itoverlays a portion of the touch sensor.
 31. A system, comprising: acover glass; a fingerprint sensor, comprising direct build-up patternedconductors disposed on the cover glass, wherein the direct build-uppatterned conductors are passive traces forming an image sensing arrayof capacitively coupled drive elements and pick up elements; a chip,connected to the fingerprint sensor, the chip being configured tocontrol the fingerprint sensor, wherein the chip comprises an excitationcircuit for energizing the drive elements and a detection circuit fordetecting corresponding signals received from the pickup elements; atouch sensor below the cover glass; and a display module below the coverglass, the display module being configured to produce a visible display.